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? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 1 overview kemets ceramic chip capacitor array in c0g dielectric is an advanced passive technology where multiple capacitor elements are integrated into one common monolithic structure. array technology promotes reduced placement costs and increased throughput. this is achieved by alternatively placing one device rather than two or four discrete devices. use of capacitor arrays also saves board space which translates into increased board density and more functions per board. arrays consume only a portion of the space required for standard chips resulting in savings in inventory and pick/place machine positions. for added reliability, kemet's flexible termination technology has been incorporated in order to provides superior fex performance. this technology was developed to address fex cracks, which are the primary failure mode of mlccs and typically the result of excessive tensile and shear stresses produced during board fexure and thermal cycling. flexible termination technology inhibits the transfer of board stress to the rigid body of the mlcc, therefore mitigating fex cracks which can result in low ir or short circuit failures. kemets c0g dielectric features a 125c maximum operating temperature and is considered stable. "the electronics industries alliance (eia) characterizes c0g dielectric as a class i material. components of this classifcation are temperature compensating and are suited for resonant circuit applications or those where q and stability of capacitance characteristics are required. c0g exhibits no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient temperature. capacitance change is limited to 30 ppm/oc from ?55c to +125c. kemet automotive grade array capacitors meet the demanding automotive electronics council's aec-q200 qualifcation requirements. surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc (commercial & automotive grade) ordering information ca 06 4 x 104 k 4 g a c tu ceramic array case size (l" x w") 1 number of capacitors specifcation/ series capacitance code (pf) capacitance tolerance rated voltage (vdc) dielectric failure rate/ design termination finish 2 packaging/ grade (c-spec) 05 = 0508 06 = 0612 2 = 2 4 = 4 x = flexible termination two signifcant digits + number of zeros j = 5% k = 10% m = 20% 8 = 10 4 = 16 3 = 25 5 = 50 1 = 100 2 = 200 g = c0g a = n/a c = 100% matte sn l = snpb (5% minimum pb content) see "packaging c-spec ordering options table" below 1 all previous reference to metric case dimension "1632" has been replaced with an inch standard reference of "0612". please reference all new designs using the "0612" nomenclature. "ca064" replaces "c1632" in the ordering code. 2 additional termination fnish options may be available. contact kemet for details. 2 snpb termination fnish option is not available on automotive grade product. one world. one kemet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 2 2 packaging c-spec ordering options table packaging type packaging/grade ordering code (c-spec) commercial grade 1 bulk bag not required (blank) 13" reel (embossed plastic tape)/unmarked 1 default packaging is "bulk bag". an ordering code c-spec is not required for "bulk bag" packaging. 1 the terms "marked" and "unmarked" pertain to laser marking option of capacitors. all packaging options labeled as "unmarked" will contain capacitors that have not been laser marked. the option to laser mark is not available on these devices. for more information see "capacitor marking". 2 reeling tape options (paper or plastic) are dependent on capacitor case size (l" x w") and thickness dimension. see "chip thickness/tape & reel packaging quantities" and "tape & reel packaging information". 2 for additional information regarding "auto" c-spec options, see "automotive c-spec information". 2 all automotive packaging c-specs listed exclude the option to laser mark components. the option to laser mark is not available on these devices. for more information see "capacitor marking". benefts ? ? 55c to +125c operating temperature range ? s uperior fex performance (up to 5 mm) ? s aves both circuit board and inventory space ? r educes placement costs and increases throughput ? l ead (pb)-free, rohs and reach compliant ? e ia 0508 (2-element) and 0612 (4-element) case sizes ? d c voltage ratings of 10 v, 16 v, 25 v, 50 v, 100 v, and 200 v ? c apacitance offerings ranging from 10 pf to 2,200 pf ? a vailable capacitance tolerances of 5%, 10%, and 20% ? n on-polar device, minimizing installation concerns ? 1 00% pure matte tin-plated termination fnish allowing for excellent solderability ? s npb termination fnish option available upon request (5% pb minimum) ? c ommercial and automotive (aecCq200) grades available applications typical applications include those that can beneft from board area savings, cost savings and overall volumetric reduction such as telecommunications, computers, handheld devices and automotive. flexible termination technology benefts applications subject to high levels of board fexure or temperature cycling. surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 3 3 automotive c-spec information kemet automotive grade products meet or exceed the requirements outlined by the automotive electronics council. details regarding test methods and conditions are referenced in document aecCq200, stress test qualif cation for passive components. these products are supported by a product change notif cation (pcn) and production part approval process warrant (ppap). automotive products offered through our distribution channel have been assigned an inclusive ordering code c-spec, auto. this c-spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without the requirement to submit a customer source controlled drawing (scd) or specif cation for review by a kemet engineering specialist. this c-spec is therefore not intended for use by kemets oem automotive customers and are not granted the same privileges as other automotive c-specs. customer pcn approval and ppap request levels are limited (see details below). product change notif cation (pcn) the kemet product change notif cation system is used to communicate primarily the following types of changes: ? product/process changes that affect product form, f t, function, and/or reliability ? changes in manufacturing site ? product obsolescence kemet automotive c-spec customer notif cation due to: days prior to implementation process/product change obsolescence* kemet assigned 1 yes (with approval and sign off) yes 180 days minimum auto yes (without approval) yes 90 days minimum 1 kemet assigned c-specs require the submittal of a customer scd or customer specif cation for review. for additional information contact kemet. production part approval process (ppap) the purpose of the production part approval process is: ? to ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. ? to provide the evidence that all customer engineering design record and specif cation requirements are properly understood and fulf lled by the manufacturing organization. ? to demonstrate that the established manufacturing process has the potential to produce the part kemet automotive c-spec ppap (product part approval process) level 1 2 3 4 5 kemet assigned 1 auto 1 kemet assigned c-specs require the submittal of a customer scd or customer specif cation for review. for additional information contact kemet. part number specif c ppap available product family ppap only surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 4 4 dimensions C millimeters (inches) top view 0612 (4-cap) w bw p p ref cl l bl t profile view top view 0508 (2-cap) w bw p p ref cl l bl t profile view eia size code metric size code l length w width bw bandwidth bl bandlength t thickness p pitch p reference 0508 1220 1.30 (0.051) 0.15 (0.006) 2.10 (0.083) 0.15 (0.006) 0.53 (0.021) 0.08 (0.003) 0.30 (0.012) 0.20 (0.008) see table 2 for thickness 1.00 (0.039) 0.10 (0.004) 0.50 (0.020) 0.10 (0.004) 0612 1632 1.60 (0.063) 0.20 (0.008) 3.20 (0.126) 0.20 (0.008) 0.40 (0.016) 0.20 (0.008) 0.30 (0.012) 0.20 (0.008) 0.80 (0.031) 0.10 (0.004) 0.40 (0.016) 0.05 (0.002) qualifcation/certifcation commercial grade products are subject to internal qualifcation. details regarding test methods and conditions are referenced in table 4, performance & reliability. automotive grade products meet or exceed the requirements outlined by the automotive electronics council. details regarding test methods and conditions are referenced in document aecCq200, stress test qualifcation for passive components. for additional information regarding the automotive electronics council and aecCq200, please visit their website at www.aecouncil.com. environmental compliance lead (pb)-free, rohs, and reach compliant without exemptions (excluding snpb termination fnish option). surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 5 5 electrical parameters/characteristics item parameters/characteristics operating temperature range ?55c to +125c capacitance change with reference to +25c and 0 vdc applied (tcc) 30 ppm/oc aging rate (maximum % capacitance loss/decade hour) 0% 1 dielectric withstanding voltage (dwv) 250% of rated voltage rgsrerglevkmglevkrsxgmrkq% 2 dissipation factor (df) maximum limit at 25oc 0.1% 3 insulation resistance (ir) limit at 25c 1,000 megohm microfarads or 100 g (rated voltage applied for 1205 seconds at 25c) 1 dwv is the voltage a capacitor can withstand (survive) for a short period of time. it exceeds the nominal and continuous working voltage of the capacitor. 2 capacitance and dissipation factor (df) measured under the following conditions: 1 m hz 100 khz and 1.0 vrms 0.2 v if capacitance 1,000 pf 1 k hz 50 hz and 1.0 vrms 0.2 v if capacitance > 1,000 pf 3 to obtain ir limit, divide m-f value by the capacitance and compare to g limit. select the lower of the two limits. capacitance and dissipation factor (df) measured under the following conditions: note: when measuring capacitance it is important to ensure the set voltage level is held constant. the hp4284 and agilent e4980 have a feature known as automatic level control (alc). the alc feature should be switched to "on." post environmental limits high temperature life, biased humidity, moisture resistance dielectric rated dc voltage capacitance value dissipation factor (maximum %) capacitance shift insulation resistance c0g all all 0.5 0.3% or 0.25 pf 10% of initial limit surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 6 6 table 1 C capacitance range/selection waterfall (0508 C 0612 case sizes) capacitance capacitance code case size/ series c0508x (ca052x 2-cap case size) c0612x (ca064x 4-cap case size) voltage code 8 4 3 5 1 8 4 3 5 1 2 rated voltage (vdc) 10 16 25 50 100 10 16 25 50 100 200 capacitance tolerance product availability and chip thickness codes see table 2 for chip thickness dimensions 10 pf 100 j k m ma ma ma ma ma ma 12 pf 120 j k m ma ma ma ma ma ma 15 pf 150 j k m ma ma ma ma ma ma 18 pf 180 j k m ma ma ma ma ma ma 22 pf 220 j k m ma ma ma ma ma ma 27 pf 270 j k m ma ma ma ma ma ma 33 pf 330 j k m ma ma ma ma ma ma 39 pf 390 j k m ma ma ma ma ma ma 47 pf 470 j k m ma ma ma ma ma ma 56 pf 560 j k m ma ma ma ma ma ma 68 pf 680 j k m ma ma ma ma ma ma 82 pf 820 j k m ma ma ma ma ma ma 100 pf 101 j k m pa pa pa pa pa ma ma ma ma ma 120 pf 121 j k m pa pa pa pa pa ma ma ma ma ma 150 pf 151 j k m pa pa pa pa pa ma ma ma ma ma 180 pf 181 j k m pa pa pa pa pa ma ma ma ma ma 220 pf 221 j k m pa pa pa pa pa ma ma ma ma 270 pf 271 j k m pa pa pa pa pa ma ma ma ma 330 pf 331 j k m pa pa pa pa pa ma ma ma ma 390 pf 391 j k m pa pa pa pa pa ma ma ma ma 470 pf 471 j k m pa pa pa pa pa ma ma ma ma 560 pf 561 j k m pa pa pa pa pa 680 pf 681 j k m pa pa pa pa pa 820 pf 821 j k m pa pa pa pa pa 1,000 pf 102 j k m pa pa pa pa pa 1,100 pf 112 j k m pa pa pa pa pa 1,200 pf 122 j k m pa pa pa pa pa 1,300 pf 132 j k m pa pa pa pa pa 1,500 pf 152 j k m pa pa pa pa pa 1,600 pf 162 j k m pa pa pa pa pa 1,800 pf 182 j k m pa pa pa pa pa 2,000 pf 202 j k m pa pa pa pa pa 2 ,200 pf 222 j k m pa pa pa pa pa capacitance capacitance code rated voltage (vdc) 10 16 25 50 100 10 16 25 50 100 200 voltage code 8 4 3 5 1 8 4 3 5 1 2 case size/series c0508x (ca052x 2-cap case size) c0612x (ca064x 4-cap case size) kemet reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (confguration and dimensions). these products are protected under us patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts. surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 7 7 table 2a C chip thickness/tape & reel packaging quantities thickness code case size thickness range (mm) paper quantity plastic quantity 7" reel 13" reel 7" reel 13" reel pa 0508 0.80 0.10 0 0 4,000 10,000 ma 0612 0.80 0.10 0 0 4,000 10,000 package quantity based on fnished chip thickness specifcations. table 2b C bulk packaging quantities packaging type loose packaging bulk bag (default) packaging c-spec 1 n/a 2 case size packaging quantities (pieces/unit packaging) eia (in) metric (mm) minimum maximum 0402 1005 1 50,000 0603 1608 0805 2012 1206 3216 1210 3225 1808 4520 20,000 1812 4532 1825 4564 2220 5650 2225 5664 1 the "packaging c-spec" is a 4 to 8 digit code which identifes the packaging type and/or product grade. when ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. see "ordering information" section of this document for further details. commercial grade product ordered without a packaging c-spec will default to our standard "bulk bag" packaging. contact kemet if you require a bulk bag packaging option for automotive grade products. 2 a packaging c-spec (see note 1 above) is not required for "bulk bag" packaging (excluding anti-static bulk bag and automotive grade products). the 15th through 22nd character positions of the ordering code should be left blank. all product ordered without a packaging c-spec will default to our standard "bulk bag" packaging. surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 8 8 table 3 C chip capacitor array land pattern design recommendations per ipc-7351 eia size code metric size code density level a: maximum (most) land protrusion (mm) density level b: median (nominal) land protrusion (mm) density level c: minimum (least) land protrusion (mm) c y x p v1 v2 c y x p v1 v2 c y x p v1 v2 0508/ca052 1220 1.60 1.00 0.55 1.00 3.50 3.30 1.50 0.90 0.50 1.00 2.90 2.80 1.40 0.75 0.45 1.00 2.40 2.50 0612/ca064 1632 1.80 1.10 0.50 0.80 3.90 4.40 1.80 0.95 0.50 0.80 3.30 3.90 1.70 0.85 0.40 0.80 2.80 3.60 density level a: for low-density product applications. provides a wider process window for refow solder processes. density level b: for products with a moderate level of component density. provides a robust solder attachment condition for refow solder processes. density level c: for high component density product applications. before adapting the minimum land pattern variations the user should perform qualifcation testing based on the conditions outlined in ipc standard 7351 (ipcC7351). image below based on density level b for an eia 0612 case size. y v2 v1 grid placement courtyard x c p surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 9 9 soldering process recommended soldering technique: ? s older refow only recommended refow soldering profle: kemets families of surface mount multilayer ceramic capacitors (smd mlccs) are compatible with wave (single or dual), convection, ir or vapor phase refow techniques. preheating of these components is recommended to avoid extreme thermal stress. kemets recommended profle conditions for convection and ir refow refect the profle conditions of the ipc/ j-std-020 standard for moisture sensitivity testing. these devices can safely withstand a maximum of three refow passes at these conditions. profle feature termination finish snpb 100% matte sn preheat/soak temperature minimum (t smin ) temperature maximum (t smax 150c 200c time (t s ) from t smin to t smax 60 C 120 seconds 60 C 120 seconds ramp-up rate (t l to t p ) 3c/second maximum 3c/second maximum 0muymsy8qtvexyv8 l ) 183c 217c time above liquidous (t l ) 60 C 150 seconds 60 C 150 seconds peak temperature (t p ) 235c 260c time within 5c of maximum peak temperature (t p 20 seconds maximum 30 seconds maximum ramp-down rate (t p to t l ) 6c/second maximum 6c/second maximum time 25c to peak temperature 6 minutes maximum 8 minutes maximum note 1: all temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly refow. time te mp erature t smin 25 t smax t l t p maximum ramp up rate = 3oc/sec maximum ramp down rate = 6oc/sec t p t l t s 25oc to peak surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 10 10 table 4 C performance & reliability: test methods and conditions stress reference test or inspection method terminal strength jisCcC6429 appendix 1, note: force of 1.8 kg for 60 seconds. board flex jisCcC6429 appendix 2, note: standard termination system C 2.0 mm (minimum) for all except 3 mm for c0g. flexible termination system C 3.0 mm (minimum). solderability jCstdC002 magnifcation 50 x. conditions: a) method b, 4 hours at 155c, dry heat at 235c b) method b at 215c category 3 c) method d, category 3 at 260c temperature cycling jesd22 method jaC104 1,000 cycles (?55c to +125c). measurement at 24 hours +/? 4 hours after test conclusion. &me,yqmmx 1-0i78i1xls 103 load humidity: 1,000 hours 85c/85% rh and rated voltage. add 100 k ohm resistor. measurement at 24 hours +/? 4 hours after test conclusion. low volt humidity: 1,000 hours 85c/85% rh and 1.5 v. add 100 k ohm resistor. measurement at 24 hours +/? 4 hours after test conclusion. milCstdC202 method 106 t = 24 hours/cycle. steps 7a and 7b not required. measurement at 24 hours +/? 4 hours after test conclusion. milCstdC202 method 107 ?55c/+125c. note: number of cycles required C 300, maximum transfer time C 20 seconds, dwell time C 15 minutes. air C air. high temperature life milCstdC202 method 108 /eiaC198 1,000 hours at 125c (85c for x5r, z5u and y5v) with 2 x rated voltage applied. storage life milCstdC202 method 108 150c, 0 vdc for 1,000 hours. vibration milCstdC202 method 204 5 g's for 20 min., 12 cycles each of 3 orientations. note: use 8" x 5" pcb 0.031" thick 7 mounted within 2" from any secure point. test from 10 C 2,000 hz milCstdC202 method 213 figure 1 of method 213, condition f. resistance to solvents milCstdC202 method 215 add aqueous wash chemical, okem clean or equivalent. storage & handling ceramic chip capacitors should be stored in normal working environments. while the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. in addition, packaging materials will be degraded by high temperatureCreels may soften or warp and tape peel force may increase. kemet recommends that maximum storage temperature not exceed 40oc and maximum storage humidity not exceed 70% relative humidity. temperature fuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. for optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 11 11 construction detailed cross section barrier layer (ni) inner electrodes (ni) barrier layer (ni) inner electrodes (ni) dielectric material (cazro 3 ) epoxy layer (ag) epoxy layer (ag) end termination/ external electrode (cu) end termination/ external electrode (cu) termination finish (100% matte sn / snpb - 5% pb min) termination finish (100% matte sn / snpb - 5% pb min) capacitor marking (optional): laser marking option is not available on: ? c 0g, ultra stable x8r and y5v dielectric devices ? e ia 0402 case size devices ? e ia 0603 case size devices with flexible termination option. ? k ps commercial and automotive grade stacked devices. these capacitors are supplied unmarked only. surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 12 12 tape & reel packaging information kemet offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with eia standard 481. this packaging system is compatible with all tape-fed automatic pick and place systems. see table 2 for details on reeling quantities for commercial chips. 8 mm, 12 mm or 16 mm carrier tape 178 mm (7.00") or 330 mm (13.00") anti-static reel embossed plastic* or punched paper carrier. embossment or punched cavity anti-static cover tape (.10 mm (.004") maximum thickness) chip and kps orientation in pocket (except 1825 commercial, and 1825 and 2225 militar y) *eia 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. kemet ? bar code label sprocket holes table 5 C carrier tape conf guration, embossed plastic & punched paper (mm) eia case size tape size (w)* embossed plastic punched paper 7" reel 13" reel 7" reel 13" reel pitch (p 1 4mxgl4 1 i 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 C 1210 8 4 4 4 4 1805 C 1808 12 4 4 1812 12 8 8 kps 1210 12 8 8 kps 1812 & 2220 16 12 12 array 0508 & 0612 8 4 4 *refer to figures 1 & 2 for w and p *refer to tables 6 & 7 for tolerance specif cations. new 2 mm pitch reel options* packaging ordering code (c-spec) packaging type/options c-3190 automotive grade 7" reel unmarked c-3191 automotive grade 13" reel unmarked c-7081 commercial grade 7" reel unmarked c-7082 commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 eia case size. 2 mm pitch reel for 0805 eia case size under development. benef ts of changing from 4 mm to 2 mm pitching spacing ? lower placement costs ? double the parts on each reel results in fewer reel changes and increased eff ciency ? fewer reels result in lower packaging, shipping and storage costs, reducing waste surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 13 13 figure 1 C embossed (plastic) carrier tape dimensions po t f w cent er line s of ca vity ao bo user direction of unre eling cover tape ko b 1 is for tape feeder reference only, including dra ft concentric abou t b o . t 2 ?d 1 ?do b 1 s 1 t 1 e 1 e 2 p 1 p 2 embossment for c avity size, see note 1 table 4 [10 pitches cumulative tolerance on tape 0.2 mm] table 6 C embossed (plastic) carrier tape dimensions metric will govern constant dimensions millimeters (inches) tape size d 0 d 1 minimum note 1 e 1 p 0 p 2 r reference note 2 s 1 minimum note 3 t maximum t 1 maximum 8 mm 1.5 +0.10/-0.0 (0.059 +0.004/- 0.0) 1.0 (0.039) (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 25.0 (0.984) (0.024) 0.600 (0.024) 0.100 (0.004) 12 mm 1.5 (0.059) 30 (1.181) 16 mm variable dimensions millimeters (inches) tape size pitch b 1 maximum note 4 e 2 minimum f p 1 t 2 maximum w maximum a 0 ,b 0 & k 0 8 mm single (4 mm) 4.35 6.25 3.5 0.05 r 4.0 0.10 r 2.5 8.3 note 5 12 mm single (4 mm) & double (8 mm) 8.2 (0.323) (0.404) (0.217 0.002) (0.315 0.004) (0.181) (0.484) triple (12 mm) 12.1 (0.476) 14.25 (0.561) 7.5 0.05 (0.138 0.002) 12.0 0.10 (0.157 0.004) 4.6 (0.181) 16.3 (0.642) 1. the embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. dimensions of embossment 2. the tape with or without components shall pass around r without damage (see figure 6). 3. if s < 1.0 mm, there may not be enough area for cover tape to be properly applied (see eia standard 481 paragraph 4.3 section b). dimension is a reference dimension for tape feeder clearance only. 5. the cavity def ned by a , b and k shall surround the component with suff cient clearance that: (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see figure 4). (e) for kps series product, a (f) see addendum in eia standard 481 for standards relating to more precise taping requirements. surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 14 14 figure 2 C punched (paper) carrier tape dimensions user direct ion of unr ee li ng top cover t ape t center li nes o f cavity p 1 ?do po e 1 f e 2 w g a 0 b 0 cavity size, see n ote 1, tab le 7 bottom cover tape t 1 t 1 bottom cover tape [10 pitc he s cumulative tolerance on tape 0.2 mm] table 7 C punched (paper) carrier tape dimensions metric will govern constant dimensions millimeters (inches) tape size d 0 e 1 p 0 p 2 t 1 maximum g minimum r reference note 2 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.10 maximum 0.75 (0.030) 25 (0.984) variable dimensions millimeters (inches) tape size pitch e2 minimum f p 1 t maximum w maximum a 0 b 0 8 mm half (2 mm) 6.25 (0.246) 3.5 0.05 (0.138 0.002) 2.0 0.05 (0.079 0.002) 1.1 (0.098) 8.3 (0.327) note 1 8 mm single (4 mm) 4.0 0.10 (0.157 0.004) 8.3 (0.327) 1. the cavity def ned by a 0 , b 0 and t shall surround the component with suff cient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20 maximum (see figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see figure 4). e) see addendum in eia standard 481 for standards relating to more precise taping requirements. 2. the tape with or without components shall pass around r without damage (see figure 6). surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 15 packaging information performance notes 1. cover tape break force: 1.0 kg minimum. 2. cover tape peel strength: the total peel strength of the cover tape from the carrier tape shall be: tape width peel strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) the direction of the pull shall be opposite the direction of the carrier tape travel. the pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. during peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. labeling: bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. refer to eia standards 556 and 624 . figure 3 C maximum component rotation ao o s max imum c ompon en t rota ti on t op view maxi mum co mponent rotat ion s id e view tape m ax imum width (mm) r otat io n ( ) ,12 20 1 C 200 10 tap e m aximum wid th ( mm) ro tat ion ( s ) ,12 20 1 C 10 2 C 200 ypical oce t center line ypical com po nent centerline figure 4 C maximum lateral movement 0.5 mm maxi mum 0.5 mm maxi mum 8 mm & 1 2 mm tap e 1.0 mm maxi mum 1.0 mm maxi mum 1 6 mm tape figure 5 C bending radius r r b en ding radius e mbo sse d carrier p unc hed ca rrier surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 ? 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 16 16 figure 6 C reel dimensions a d (see note) full radi us, see note b (see note) access hole at slot location (? 40 mm minimum) if present, tape slot in core for t ap e start: 2.5 mm minimum width x 10.0 mm minimum depth w3 (includes flange distortion at outer edge) w2 (m ea sured at hu b) w1 (m ea sured at hu b) c (arbor hole diameter) note: drive spokes optional; if used, dimensions b and d shall apply. n table 8 C reel dimensions metric will govern constant dimensions millimeters (inches) tape size a b minimum c d minimum 8 mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm variable dimensions millimeters (inches) tape size n minimum w 1 w 2 maximum w 3 8 mm 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 14.4 (0.567) shall accommodate tape width without interference 12 mm 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) (0.724) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) (0.882) surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 17 17 figure 7 C tape leader & trailer dimensions trailer 16 0 mm minimum carrier t ape end start rou nd sp rock et holes el ongated spro ck et holes ( 32 mm tape and wi de r) t op co ve r t ape top c ove r t ape p unche d carrier 8 mm & 12 mm only e mboss ed carrier components 100 mm minimum leader 400 mm minimum figure 8 C maximum camber carrier tape round sprocket holes 1 mm ma ximum , either direction straight edge 250 mm elongated sprocket holes (32 mm & wider ta pe s) surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1016_c0g_array_smd ? 10/14/2016 18 18 kemet electronic corporation sales off ces for a complete list of our global sales off ces, please visit www.kemet.com/sales. disclaimer all product specif cations, statements, information and data (collectively, the information) in this datasheet are subject to change. the customer is responsible for checking and verifying the extent to which the information contained in this publication is applicable to an order at the time the order is placed. all information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. statements of suitability for certain applications are based on kemet electronics corporations (kemet) knowledge of typical operating conditions for such applications, but are not intended to constitute C and kemet specif cally disclaims C any warranty concerning suitability for a specif c customer application or use. the information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. any technical advice inferred from this information or otherwise provided by kemet with reference to the use of kemets products is given gratis, and kemet assumes no obligation or liability for the advice given or results obtained. although kemet designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. although all productCrelated warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. kemet is a registered trademark of kemet electronics corporation. surface mount multilayer ceramic chip capacitors (smd mlccs) capacitor array, c0g dielectric, 10 C 200 vdc, (commercial & automotive grade)

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